All organizational 3bymesa structure focuses on providing customers electronic manufacturing services (EMS) with the highest level of professionalism, technical knowledge and efficiency in time and cost.
Flexibly production capacity, from prototypes to small or large series, capable for assembly in SMD or conventional technologies. SMD modern lines with a total capacity of 55,000 components / hour, plus ability to assembly every components size
Single and Double refusion lines for lead-free components from 0201 to Micro-BGA, BGA and large formats.
Through Hole assembly process.
Wave soldering process.
Final assembly process.
Factory – prototyping of high complexity (BGA, Micro BGA, etc.)
Advanced Soldering Processes (Lead-Free).
Technology – Chip-on-Flex surface mount components on flexible substrates.
X-Ray assembly control.
Varnish and encapsulated.